India targets $150 billion semiconductor value chain through packaging, design and manufacturing push

The roadmap could create opportunities across AI infrastructure, data centres, cloud and engineering services.

Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.

India has released a 10-year semiconductor roadmap targeting a USD 120 billion to 150 billion semiconductor value chain by 2035 through investments in chip design, advanced packaging, compound semiconductors and talent development.

Released by NITI Aayog's Frontier Tech Hub, the roadmap outlines a strategy to reduce India's dependence on imported semiconductor technologies while building deeper capabilities across design, manufacturing, packaging, research and ecosystem development, moving beyond simply attracting investments to strengthening the full value chain.

The roadmap will create opportunities across AI infrastructure, data centres, cloud services, cybersecurity, engineering services, industrial automation and semiconductor design.

Semiconductors support artificial intelligence, telecommunications, digital infrastructure, defence systems, healthcare technologies, automotive electronics and advanced manufacturing.

According to the roadmap, India plans to leverage its strengths in semiconductor design talent, electronics manufacturing, innovation capabilities and growing domestic demand to build a stronger position within the global semiconductor ecosystem.

The roadmap is structured around five focus areas covering research and design, policy and investments, production capabilities, talent development and international partnerships.

Focus on packaging and manufacturing capabilities

One of the key areas of focus is advanced packaging and outsourced semiconductor assembly and test (OSAT), which the roadmap identifies as a major opportunity for India. Rather than competing immediately in leading-edge semiconductor fabrication, India aims to strengthen capabilities in packaging technologies that are critical as chip architectures grow more complex.

The roadmap also highlights compound semiconductors and wide-bandgap semiconductor technologies as strategic areas for future growth. These technologies are widely used in electric vehicles, renewable energy systems, industrial electronics, telecommunications infrastructure and defence applications.

As semiconductor manufacturing facilities and packaging plants scale operations, technology vendors and channel partners are likely to see opportunities across factory automation, industrial connectivity, cybersecurity, data management and operational monitoring platforms.

Expand semiconductor design and AI infrastructure

Another major focus area is semiconductor design and intellectual property development. The roadmap aims to strengthen India's position as a global semiconductor design hub, setting a goal of creating over 100 advanced semiconductor design IPs.

India already plays an important role in global semiconductor design. It hosts R&D and engineering centres for companies including Intel, Qualcomm and Texas Instruments. The roadmap seeks to encourage more domestic innovation and design-led semiconductor development.

For the technology ecosystem, this could drive additional demand for high-performance computing infrastructure, cloud platforms, AI development environments and specialised semiconductor design software. Chip design depends on large-scale compute resources, simulation platforms and AI-assisted development tools, creating opportunities for infrastructure providers, cloud companies and technology partners supporting research and engineering workloads.

As AI adoption accelerates across industries, semiconductor design and AI infrastructure are becoming interconnected, further strengthening demand for enterprise infrastructure, data centre capacity and cloud-based engineering platforms over the coming decade.

Build broader technology ecosystem

Talent development forms another central pillar of the roadmap. India aims to strengthen capabilities across the semiconductor talent pyramid, covering researchers, engineers, designers, technicians and manufacturing specialists.

For the channel, this translates into concrete opportunities, including lab infrastructure deployments, training platform integrations, LMS implementations and technology partnerships with engineering institutions building semiconductor curricula.

The roadmap highlights the importance of trusted international partnerships as countries seek resilient and secure semiconductor supply chains. For technology vendors and channel partners, these collaborations could support the growth of engineering services, research infrastructure, design ecosystems and manufacturing support technologies.

The roadmap aligns with priorities announced under India Semiconductor Mission 2.0. Over the next decade, it will influence investments across semiconductor infrastructure, research, manufacturing and technology services.

While semiconductor manufacturing remains the headline opportunity, the broader impact is likely to extend across AI infrastructure, cloud computing, data centres, cybersecurity, industrial technology and engineering services that support the development of a domestic semiconductor ecosystem.