Micron opens India’s first semiconductor assembly and test facility in Gujarat
Sanand site backed by $2.75 billion investment begins commercial production.
Micron Technology has inaugurated its semiconductor assembly and test facility in Sanand, Gujarat, marking India’s first commercial semiconductor assembly operation.
The facility converts advanced DRAM and NAND wafers from Micron’s global manufacturing network into finished memory and storage products.
The project represents a combined investment of approximately $2.75 billion by Micron and its government partners.
The Sanand site has begun commercial production and is ISO 9001:2015 certified.
Once fully ramped, the first phase will feature more than 500,000 square feet of cleanroom space, making it one of the largest single-floor assembly and test cleanrooms globally.
Micron expects to assemble and test tens of millions of chips at the site in 2026, scaling to hundreds of millions in 2027.
The company presented its first shipment of memory modules manufactured in India to Dell Technologies. The modules will be used in laptops produced in India for the domestic market.
Micron’s chairman, president and CEO Sanjay Mehrotra said the facility strengthens the company’s global assembly and test network and supports growing demand for memory and storage driven by AI workloads.
The inauguration ceremony was attended by Narendra Modi, Gujarat Chief Minister Bhupendra Patel, and Union Minister for Electronics and IT Ashwini Vaishnaw.
The facility is designed to meet or exceed LEED Gold standards and incorporates water-saving technologies to enable zero liquid discharge.
Micron said the expansion of assembly and test operations in India complements its planned advanced manufacturing and packaging investments in the United States.
The company is also partnering with universities and training institutions to support semiconductor talent development and workforce readiness in India.
With the Sanand facility now operational, Micron expands its global footprint while establishing India as part of its semiconductor assembly and test network.
India’s ambitious plans for 2035
The Union Budget 2026–27 has allocated ₹1,000 crore for the next phase of the India Semiconductor Mission (ISM 2.0) to focus on developing semiconductor equipment and materials in India, advancing full-stack Indian semiconductor intellectual property, and reinforcing both domestic and global supply chains.
As of December 2025, 10 semiconductor projects with a combined investment of ₹1.60 lakh crore have been approved across six states under earlier phases of the programme.
By 2029, India is expected to develop the capability to design and manufacture chips catering to nearly 70 to 75 per cent of its domestic demand.
The next phase under Semicon 2.0 will focus on advancing manufacturing technologies, with a roadmap targeting 3-nanometre and 2-nanometre nodes.
By 2035, India aims to position itself among the leading semiconductor manufacturing nations globally.