Refroid Technologies and Technavious Solutions partner to build liquid cooling infrastructure for AI data centres in India
Collaboration combines Refroid’s liquid cooling technologies with Technavious’s data centre engineering and certification expertise.
The companies said the collaboration will deliver a validated “brick-to-chip” infrastructure framework that supports high-density AI computing environments.
The initiative aims to address the growing thermal challenges in data centres as AI workloads increase compute density.
According to the companies, next-generation processors are exceeding 500W thermal design power, pushing traditional air-cooled data centre facilities close to operational limits.
As a result, operators are exploring liquid cooling technologies to manage heat generated by large-scale GPU deployments.
The partnership combines Refroid’s liquid cooling technologies with Technavious’s expertise in data centre engineering, commissioning and certification.
Technavious specialises in mechanical, electrical and plumbing (MEP) design and data centre certification under the TIA‑942 standard.
Under the partnership, Technavious will integrate Refroid’s Sentraflo Coolant Distribution Units (CDUs) into hyperscale data centre infrastructure designs.
This will enable facilities to support large GPU clusters while maintaining reliability standards required for AI infrastructure.
The collaboration will introduce liquid immersion cooling pods for enterprise and edge deployments.
These systems are intended for captive data centres and remote edge nodes where operators may want to deploy high-density AI computing without major infrastructure retrofits.
Technavious will provide site-readiness engineering to enable the deployment of systems within existing facilities.
Addressing the infrastructure commissioning gap
The partnership also focuses on infrastructure testing and validation before AI hardware is deployed.
Refroid’s hybrid load banks will be integrated into Technavious’s Level 1–7 commissioning lifecycle for data centre infrastructure.
This approach enables operators to test both cooling and power systems before installing expensive IT hardware.
Technavious Solutions’ CEO, Senthil Kumar R, said integrating Refroid’s liquid cooling technologies into TIA-942 compliant designs will help organisations deploy efficient liquid-cooled AI infrastructure.
The system supports Level 5 Integrated System Testing (IST) by simulating liquid and air thermal loads.
This allows data centre operators to validate system performance and resilience before moving into production environments.
Refroid Technologies’ CEO, Satya Bhavaraju, said standardising liquid cooling infrastructure requires an engineering lifecycle that ensures systems are validated before deployment.
He added that combining Refroid’s direct liquid cooling and immersion technologies with Technavious’s commissioning expertise provides operators with a structured approach to preparing data centre infrastructure for AI workloads.