Advancing chip production to meet global demands

Lam Research’s ALTUS Halo and Akara are designed to help chipmakers overcome the most pressing bottlenecks in chip scaling – from achieving tighter integration to reducing defect rates in complex 3D structures.

The semiconductor industry in Southeast Asia continues to face mounting challenges in the region, given the increasing geopolitical tension that is arising between China and the US. While this has been an ongoing issue for several years, the reality is, most semiconductor companies operating in the region have well planned strategies to deal with any scenarios that can arise from the situation.

Geopolitical issues have also not slowed down innovation in the semiconductor industry. AI breakthroughs in the industry continue to enhance production and efficiencies in the industry. According to statistics from Deloitte, predicted sales for the semiconductor industry in 2025 could reach US$697 billion, a new all-time high, and well on track to reach the widely accepted aspirational goal of US$1 trillion in chip sales by 2030.

One company that has been dealing with the increasing demand for chips with modern productivity methods is Lam Research. Andrew Goh (pictured below), Corporate Vice President and General Manager, Southeast Asia at Lam Research shares more about Lam Research’s presence in the region, especially when it comes to supporting the demand for chips in an interview with CRN Asia.

Can you share with us an overview of the semiconductor industry currently and the role Lam Research plays in it.

The semiconductor industry is undergoing rapid transformation, driven by breakthroughs in AI, edge computing, automotive technologies, and next-generation connectivity. These applications demand increasingly powerful, compact, and energy-efficient chips, pushing the limits of traditional semiconductor scaling. As a result, innovation is not only required at the design level but also within the manufacturing process itself.

Lam Research plays a foundational role in this global ecosystem. As a leading supplier of wafer fabrication equipment and services, Lam’s technologies are used to produce virtually every advanced chip on the market. The company specializes in critical process steps such as etch and deposition, as well as advanced packaging — capabilities that are essential to enabling cutting-edge semiconductor architectures. By working closely with global customers and partners, Lam helps drive the innovation required to meet the growing demand for compute performance, while also advancing precision, and productivity in chip manufacturing.

How is Lam Research addressing scaling demands through process innovation?

As Moore’s Law slows and device scaling becomes increasingly vertical, the semiconductor industry is facing a new class of engineering challenges. It’s no longer just about shrinking features, it’s about building taller, denser structures with atomic-level precision. Lam Research is helping customers navigate these challenges by developing process innovations that unlock new levels of performance, efficiency, and manufacturability.

We’re addressing these demands through a combination of advanced material processing, etch and deposition innovations such as our new breakthrough ALTUS Halo platform for atomic layer deposition of molybdenum and the recent introduction of Akara, the most advanced conductor etch tool available, and continuing to invest in and enhance our research and development.

Lam is also incorporating AI and machine learning into its tools and workflows, optimizing development timelines, reducing process variability, and improving fab productivity. These innovations allow chipmakers to move past traditional scaling limitations and deliver higher-density, lower-power chips for data-intensive applications.

Can you share Lam Research's role in advanced etch and deposition in enabling next-gen chip architectures?

Etch and deposition are two of the most critical process steps in semiconductor manufacturing, and Lam Research leads the industry in both. These technologies form the building blocks of next-generation architectures by enabling atomic-level control over material placement and removal, essential for forming the intricate, high-aspect-ratio structures found in 3D NAND, GAA, and future 3D DRAM devices.

Lam’s etch portfolio includes cutting-edge platforms like Akara, our atomic layer etch system designed for precision material removal at the angstrom scale. Akara is used to pattern and sculpt features in advanced logic and memory devices where conventional techniques fall short.

On the deposition side, Lam’s new ALTUS Halo platform — the world’s first atomic layer deposition (ALD) tool to use molybdenum — enables the formation of highly conductive, low-resistivity films for next-gen interconnects. Molybdenum is emerging as a preferred material to replace tungsten as scaling requirements become more stringent, and Lam is leading this transition with early adoption underway in 3D NAND and logic fabs.

Together, Lam’s etch and deposition solutions provide the accuracy, uniformity, and reliability needed to support the most advanced semiconductor nodes, empowering customers to push the boundaries of chip design and performance.

How are tools like ALTUS Halo and Akara are helping chipmakers meet future demand?

ALTUS Halo uses molybdenum in its atomic layer deposition process to produce ultra-thin, conformal films with lower resistivity and superior step coverage. This makes it ideal for high aspect ratio structures in 3D NAND and logic interconnects, where traditional materials like tungsten are approaching their physical limits. ALTUS Halo is already being adopted by major memory and logic customers for volume production.

Akara is Lam’s next-generation atomic layer etch solution, built to deliver precision and uniformity at advanced nodes. It provides selective, controlled etching for extremely thin layers, helping customers maintain critical dimensions while reducing variability and damage to surrounding structures – this becomes increasingly important as the industry transitions to GAA and other 3D logic designs.

Together, these platforms are enabling chipmakers to meet the demands of emerging applications in AI, cloud computing, and mobility – where every layer, every nanometer, and every electron counts.

Southeast Asia is growing to be a key region in supporting global semiconductor manufacturing. What are the opportunities and challenges Lam Research foresees in the region?

Lam has had a presence in Southeast Asia for over three decades, capitalizing on the tremendous pool of technological talent in the region. Our operations in Singapore play a critical role in supporting engineering services, customer training, and workforce development.

The opportunities in the region are vast, and we are proud to collaborate with our customers and partners to help enhance the region’s contribution to the global semiconductor ecosystem. However, challenges persist in the industry in the form of a widening skills gap and the need to attract more young professionals to pursue semiconductor-related careers. Lam is addressing this through collaboration with education institutions and public sector partners, including the use of immersive workforce training tools like our Semiverse Solutions to help accelerate skills development across the region.

Lastly, how is Lam Research managing its supply chain and partner ecosystem given the uncertainties in the industry currently?

Lam Research has been integral to the global semiconductor ecosystem for over four decades. By working closely with a diverse and expanded network of great partners, including many here in the region, we have built the strongest and most resilient supply chain in our company’s history.